The fierce competition in the consumer electronics market has also put forward new requirements for the quality of electronic components. In order to ensure the peace of mind and safety of electronic products, ensuring product quality has become a critical issue in the manufacturing industry.
The fierce competition in the consumer electronics market has also put forward new requirements for the quality of electronic components. In order to ensure the peace of mind and safety of electronic products, ensuring product quality has become a critical issue in the
manufacturing industry.During NEPCON ASIA 2023, Omron Automation (China) Co., LTD. (hereinafter referred to as "Omron"), as an automation leader and testing industry expert at the exhibition for more than 10 consecutive years, showcased a wide range of equipment lineup, testing technologies and solutions in the field of testing. And for the first time
demonstrated the ultra-high resolution 3D X-ray CT system XVA-160αⅡZ, enabling the inspection industry to work together with customers to solve manufacturing problems.
In a live interview with the organizer of NEPCON ASIA, Liu Ping, South China Minister of Omron Testing System, introduced that this exhibition, Omron presents the concept of the whole line to the audience, based on many years of testing experience, combined with customer practice, to bring you many professional testing equipment and industry cutting-edge solutions in the field of SMT. Omron's forward-looking technology and super
strength are fully displayed.
This is the first time the device has been shown at NEPCON ASIA. The device has three features, first, can achieve ultra-high magnification (2000 times), nanoscale size (250/800nm) ultra-high resolution; Second, a concentric table (anywhere on the table) where the eye point does not move when the detector is tilted or the sample is rotated; Third, the ability to take CT images of samples with high aspect ratios at high magnification is simple for anyone. Three features make it possible to resolve more subtle problems and prevent undesirable outflows.
Due to the miniaturization of the substrate,
high-density actual installation of design changes, and multi-layer stacking, it is difficult to detect traditional 2D and 2.5D, but accurate inspection and analysis can be achieved through 3D CT. The Omron VT-X750 is dedicated to zero defects, and by introducing inspection algorithms suitable for various parts, it can cope with the inspection of various defects and ensure the stability of quality.
The VT-X750 V3 is significantly faster than the previous V1 and V2 models, with a top speed of 1.5 times faster than before. The processing of CT software algorithm has also
achieved high speed, and the program production is more convenient. In addition, there are different kinds and rich component libraries, which can quickly realize the Teaching and production line switch in a short time. Offline programming does not occupy the debugging time of the equipment, and can realize real-time debugging and real-time updating of the machine program.
As a high-speed, high-quality inspection device with full 3D-CT, the VT-X750 is widely used in the non-destructive inspection of 5G infrastructure/modules and on-board electrical components, as well as in aerospace, industrial equipment, semiconductors and other fields. In recent years, this model has been used for
power devices such as IGBTs and MOSFETs necessary for electric vehicles, solder internal bubbles of mechatronics products, solder filling of through-hole connectors, and so on.
Some invisible defects of the substrate, such as virtual welding, are difficult to detect through 2D, and the false report rate and misjudgment rate of 2D inspection equipment are also high, so it is necessary to import 3D inspection equipment. The Omron VT-S1080 uses four
projectors and Moorstreak light for 3D calculations, using the color of the solder to calculate Angle and height for true 3D detection.
