Model: IS200HFPAG2ADC
Category: Fan power module
Finish: New, not new
Stock: Yes
Brand: GE
Mainboard version: G2 series
Exciter voltage measurement: 1000 VRMS format
Flux/hollow coil connectors: TB 4
Input power potential transformer: (PPT)
Phase voltage transformer: 4
Product description
The IS200HFPAG2ADC is a PCB component created by GE to accommodate the Mark VI system. The MKVI is one of the last systems to be released by GE in the Speedtronic gas turbine and steam turbine management series. The Mark VI has a central control module that is connected to the rest of the system via a terminal board.
The IS200HFPAG2ADC is used as a high frequency AC/fan power supply board. Since this is a multi-purpose board, it can be installed in different cabinets in different locations of the drive system. The circuit board is usually mounted near the board frame or fan housing. The board receives an AC or DC input voltage and then converts it into an output voltage, such as a square wave or square wave, which is used to power a circuit isolated from high voltage. The board receives voltage input through four snap connectors. The voltage output is via eight plug connectors.
The IS200HFPAG2ADC has four built-in fuses to protect the board circuit. It also has a single MOV or metal oxide varistor that can also protect the circuit. The board has two radiators, two transformers, two LED (light-emitting diode) transistors, and three high-voltage capacitors. The board uses capacitors of other materials (polyester, vinyl, ceramic). Resistors are usually made of metal film materials. The components can be fixed on the circuit board by welding, socket, etc., and connected by wires to form a complete circuit.
Transmission signal: Wires and conductive patterns on the circuit board can transmit signals and power to achieve connection and signal transmission between components. Different circuit functions can be realized by designing different circuit board routing methods.
Protective components: The circuit board can play a role in protecting components to prevent components from being affected by mechanical damage, dust, moisture and other external environments. In addition, the insulation layer on the circuit board can also prevent short circuits between components.
Improved integration: By laying out components, connecting wires and conductive patterns on the circuit board, multiple components can be connected and work together to achieve more complex circuit functions. At the same time, the design of the circuit board can also realize the high integration of the circuit and reduce the volume and weight of the circuit.
